APPLICATION AREAS II-18 Biological Applications II-18 Microfluidics II-18Electronic Devices II-19 Semiconductors II-19 Optoelectronics II-19 IntegratedCircuits

APPLICATION AREAS II-18 Biological Applications II-18 Microfluidics II-18Electronic Devices II-19 Semiconductors II-19 Optoelectronics II-19 IntegratedCircuits II-19 Nano-optics II-20 Nanosensors II-21 Potential IndustryRequirements for Hot Embossing Lithography II-21 Potential Industry Requirementsfor UV-NIL II-22 4. INTRODUCTION II-1 Current and Future Analysis II-1 Polymer Electronics toPropel Demand for Nanopatterning II-2 Semiconductor Industry Spending CutsUnlikely to Cause Major Impact II-2 NIL - A Strong ContenderII-2 2. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONSStudy Reliability and Reporting Limitations I-1 Disclaimers I-2 DataInterpretation & Reporting Level I-3 Quantitative Techniques & Analytics I-3Product Definitions and Scope of Study I-3 Nanoimprint LithographyI-3 HotEmbossing I-4 UV Nanoimprint Lithography I-4 Soft Lithography I-4 Others I-4Scanning Probe Nanolithography I-4 Others I-4 II EXECUTIVE SUMMARY1. Market data and analytics are derived from primaryand secondary research. Company profiles are mostly extracted from URL researchand reported select online sources I. EV Group,Hewlett-Packard Development Company, L.P., IMS Chips, International BusinessMachines Corp., Micro Resist Technology GmbH, Molecular Imprints, Inc., NanoInk,Inc., Nanonex Corp., NanoOpto Corp., NIL Technology, Obducat AB, Optomec, Inc.,Sigma-Aldrich Corp., STMicroelectronics N.V., SUSS MicroTec AG, ToppanPhotomasks, Inc., Transfer Devices, Inc., Veeco Instruments, Inc., and VistecSemiconductor Systems GmbH.

The report profiles 28 companies including many key and nicheplayers worldwide such as Ambios Technology, Inc., AMO GmbH. Annual forecasts are provided for the period of 2005through 2015. NEW YORK--(Business Wire)--Reportlinker announces that a new market research report is available in itscatalogue. Reportlinker Adds Nanopatterning http:// report analyzes the Global Market for Nanopatterning in Millions of US$.The market for "Nanopatterning" in this report is analyzed by the followingtechnology types - Nanoimprint Lithography (Hot Embossing Lithography, UVNanoimprint Lithography, Soft Lithography, & Others), Scanning ProbeLithography, and Other. (China) III-63Thermal Integration Technology, Inc (Taiwan) III-64 To order this report:Reportlinker Adds Thermal Management Technologies (HeatSinks) http://(Heat-Sinks).htmlMore market research reports here!ReportlinkerNicolas: US: (805)-652-2626Intl: +1 805-652-2626 Copyright Business Wire 2009. ASIA PACIFIC III-54 A.Market AnalysisIII-54 Current and Future AnalysisIII-54 Mainland China Heat Sinks Market III-54 Taiwan Market Scenario III-54Product Innovations III-55 Product Launches/Developments III-56 StrategicCorporate Developments III-57 Select Players III-59 Act-Rx Technology Corp.(Taiwan) III-59 Aerocool Advanced Technologies Corp. (Taiwan) III-60 ADDA Corp.(Taiwan) III-60 Arkua Technology Co., Ltd (Taiwan) III-60 Asia Vital ComponentsCo Ltd (Taiwan) III-60 ASUSTeK Computer, Inc (Taiwan) III-61 Chaun ChoungTechnology Corp (Taiwan) III-61 Cooler Master Co Ltd (Taiwan) III-62 EVERCOOLThermal Co., Ltd (Taiwan) III-62 GlacialTech, Inc (Taiwan) III-62 KuangThousand Technology Co., Ltd (Taiwan) III-62 Neng Tyi Co Ltd (Taiwan) III-63Polo Tech Co Ltd (Taiwan) III-63 Taisol Electronics Co Ltd.

JAPAN III-39 A.Market AnalysisIII-39 Current and Future Analysis III-39Product Innovations III-39 Strategic Corporate Developments III-41 SelectPlayers III-42 Alpha Company Ltd (Japan) III-42 Sumitomo Electric Industries,Ltd. (USA)III-26 Radian Heat sinks (US) III-26 Swiftech (US) III-27 Tennmax United (USA)III-27 Thermacore (USA) III-27 Thermalright, Inc (USA) III-28 United ThermalEngineering Corp (USA) III-28 Vantec Thermal Technologies, Inc (US) III-29Vette Corp (USA) III-29 Wakefield Thermal Solutions, Inc. Ltd (Taiwan) II-60 Verax Ventilatoren GmbH (Germany) II-61Vette Corp (USA)II-61 Wakefield Thermal Solutions, Inc (US) II-61 10. THE UNITED STATES III-1 A.Market AnalysisIII-1 Market OverviewIII-1 ProductInnovations III-2 Product Launches/Developments III-4 Strategic CorporateDevelopments III-14 Select Players III-24 Aavid Thermalloy, LLC (USA)III-24Advanced Thermal Solutions, Inc (USA) III-24 Ajigo Corp (USA) III-24 CTS Corp.(USA) III-25 Cool Innovations, Inc (USA) III-25 Dynatron Corp (USA) III-25Enertron, Inc (USA) III-26 JMC Products, Inc (USA) III-26 Melcor Corp. (China) II-58 TennMax United (USA) II-59Thermal Integration Technology, Inc (Taiwan) II-59 Thermacore (USA) II-59Thermalright, Inc. (USA) II-60 Thermaltake Technology Co., Ltd (Taiwan) II-60Titan Computer Co.

FOCUS ON SELECT GLOBAL PLAYERS II-52 Aavid Thermalloy, LLC (USA) II-52Aerocool Advanced Technologies Corp (Taiwan) II-52 ADDA Corp (Taiwan) II-52Advanced Thermal Solutions, Inc (USA) II-52 Ajigo Corp (USA)II-53 Akasa Group(UK) II-53 Alpha Company Ltd (Japan) II-53 Asia Vital Components Co Ltd.(Taiwan) II-54 ASUSTeK Computer Inc. (Taiwan)II-54 Chaun Choung Technology Corp.(Taiwan) II-54 Cooler Master Co Ltd (Taiwan) II-55 Dynatron Corp (USA) II-55Enertron Inc (USA) II-55 GlacialTech, Inc (Taiwan) II-56 JMC Products, Inc.(USA) II-56 Melcor Corp (USA) II-56 Neng Tyi Co Ltd (Taiwan) II-57 Polo TechCo Ltd (Taiwan) II-57 R-Theta Thermal Solutions, Inc. (Canada) II-57 RadianHeat Sinks (US) II-57 Sumitomo Electric Industries, Ltd (Japan) II-58 Swiftech(US) II-58 Taisol Electronics Co Ltd. THERMAL MANAGEMENT PRODUCTS - CLASSIFICATION II-19 Hardware II-19 Heat PipesII-19 Micro Channels II-19 Spray Cooling II-19 Electronic Cooling Fans II-19Metal BackplanesII-20 BGAs II-20 Table 1: Leading Players in the Worldwide Thermal Management Hardware Market(2006 & 2007) - Percentage Share Breakdown by Value Sales for Aavid Thermalloy,Thermacore, Lytron, and Others (includes corresponding Graph/Chart) II-21Software II-21 Computational Methods of Heat Transfer (CHT) and Fluid Dynamics(CFD) II-21 Electronic Design Automation (EDA) Software, Electronic ComputerAided Design (ECAD) Software, and Technology Computer Aided Design (TCAD)Software II-21 Interfaces and Substrates II-22 Thermal Compounds and ThermalInterface Materials II-22 7. END USE APPLICATIONS OF HEAT SINKS II-16 Computers II-16TelecommunicationII-17 Medical II-17 Industrial Electronics II-17Aerospace/Military II-17 Consumer Electronics II-18 Automotive II-18 6.